JPH0428441U - - Google Patents
Info
- Publication number
- JPH0428441U JPH0428441U JP6907590U JP6907590U JPH0428441U JP H0428441 U JPH0428441 U JP H0428441U JP 6907590 U JP6907590 U JP 6907590U JP 6907590 U JP6907590 U JP 6907590U JP H0428441 U JPH0428441 U JP H0428441U
- Authority
- JP
- Japan
- Prior art keywords
- bump
- bonding
- protrusion
- semiconductor element
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6907590U JPH0428441U (en]) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6907590U JPH0428441U (en]) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428441U true JPH0428441U (en]) | 1992-03-06 |
Family
ID=31604067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6907590U Pending JPH0428441U (en]) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428441U (en]) |
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1990
- 1990-06-29 JP JP6907590U patent/JPH0428441U/ja active Pending